Coolermaster NanoFusion Revolutionary Thermal Compound

Vikingod · Dec 28, 2005, 08:59 AM

Thermal grease is the heat conducting interface between heatsink and CPU. It is an essential necessity in PC assembly. All PC overclockers know the importance of choosing the most efficient heat conductor to ensure achievement of the utmost results. This tiny tube of thermal compound can significantly affect the success of your overclocking result.

Being a true innovator in providing PC thermal solution, Cooler Master considers every aspect of cooling, including providing the best solution for a small air gap. NanoFusion - the revolutionary thermal compound newly released by Cooler Master - surpasses every overclocker's expectation in terms of its Bond Line Thickness (BLT), Thermal Conductivity, Thermal Resistance and Specific Gravity. With the accomplished 0.019mm BLT, NanoFusion has successfully minimized thermal resistance to 0.065 ¢J -cm 2/w @ 40psi, which has been proven to be unmatched by any other thermal grease in the market.
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Press Release: Coolermaster

BWX · Dec 28, 2005, 12:15 PM

Quote:

. In addition, NanoFusion is comprised of non-electrical conductive material, to prevent system short circuitry.

Maybe this will replace my Ceramique

Dec 28, 2005, 08:59 AM	#1
Vikingod Int'l Fish Liaison Join Date: Jul 2004 Location: By the light of lamp I sit and type... Posts: 16,149 Rep Power: 85 System Specs	Coolermaster NanoFusion Revolutionary Thermal Compound Thermal grease is the heat conducting interface between heatsink and CPU. It is an essential necessity in PC assembly. All PC overclockers know the importance of choosing the most efficient heat conductor to ensure achievement of the utmost results. This tiny tube of thermal compound can significantly affect the success of your overclocking result. Being a true innovator in providing PC thermal solution, Cooler Master considers every aspect of cooling, including providing the best solution for a small air gap. NanoFusion - the revolutionary thermal compound newly released by Cooler Master - surpasses every overclocker's expectation in terms of its Bond Line Thickness (BLT), Thermal Conductivity, Thermal Resistance and Specific Gravity. With the accomplished 0.019mm BLT, NanoFusion has successfully minimized thermal resistance to 0.065 ¢J -cm 2/w @ 40psi, which has been proven to be unmatched by any other thermal grease in the market. __________ Press Release: Coolermaster __________________ *How You Can Help DriverHeaven By Using Digg*