rief interview with VIA's Tim Handley

***Zardon*** · Mar 1, 2004, 08:21 AM

"What can you tell us about the new Esther core? Will it be a socketed CPU or soldered like the current Nehemiah CPUs?

We will continue to provide Socket 370 VIA C3 processors as long as there is demand for them. However, the demand for EBGA packaged VIA C3 processors is a lot greater than that of Socket 370 at the moment and is growing month on month. Naturally, the VIA Eden and VIA Antaur processors are only available in the EBGA and nanoBGA (for VIA Eden-N) packages. Bear in mind that VIA processors target small footprint devices that are low profile, quiet and power efficient. The EBGA package helps to achieve lower profiles because it is slimmer than the Socket 370 package and it doesn't need a raised Socket in order to attach it to the board. Furthermore, it allows better heat dissipation and lower power consumption because electrical charges have less distance to travel than is the case with the Socket 370 package. The EBGA package is far better for the type of systems that we have in mind for VIA processors. "

Pyroport

Mar 1, 2004, 08:21 AM	#1
*Zardon* enchanted Join Date: May 2002 Location: Driverheaven Posts: 32,285 Rep Power: 3150	Brief interview with VIA's Tim Handley "What can you tell us about the new Esther core? Will it be a socketed CPU or soldered like the current Nehemiah CPUs? We will continue to provide Socket 370 VIA C3 processors as long as there is demand for them. However, the demand for EBGA packaged VIA C3 processors is a lot greater than that of Socket 370 at the moment and is growing month on month. Naturally, the VIA Eden and VIA Antaur processors are only available in the EBGA and nanoBGA (for VIA Eden-N) packages. Bear in mind that VIA processors target small footprint devices that are low profile, quiet and power efficient. The EBGA package helps to achieve lower profiles because it is slimmer than the Socket 370 package and it doesn't need a raised Socket in order to attach it to the board. Furthermore, it allows better heat dissipation and lower power consumption because electrical charges have less distance to travel than is the case with the Socket 370 package. The EBGA package is far better for the type of systems that we have in mind for VIA processors. " Pyroport