Iria

Sunnyvale, CA—December 16, 2008—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the Flex EX memory series, featuring breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR2 and DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end
gaming and overclocking systems.

Offering some of the industry’s fastest modules to date, the Flex EX series encompasses the needs of enthusiasts, power users, and gamers with incredible frequencies up to DDR3-2000, and DDR2-1200 as the fastest DDR2 4GB kit available. The Flex EX Series has a specifically tailored configuration for all users to maximize the performance for all types of systems.

“Memory is the primary storage device of any modern computer system and defines how fast the CPU can access data,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Density, frequency, and access latencies of the system memory are the critical factors for overall performance of any PC and that is where the new OCZ Flex Ex series sets new standards by providing the optimal combination of the three factors for any system architecture by offering unprecedented speed and latencies at 4GB density with advanced cooling options to enhance stability and performance in even the most demanding environments.”

The OCZ Flex EX thermal management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features the integrated liquid injection system design which originated in the OCZ Flex XLC (Xtreme Liquid Convection) Series. This latest series was engineered with a “flexible” all-aluminum design to give enthusiasts the option to run the modules water-cooled or passively via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
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Source: OCZ Emailed Press Release