MIG-31

Asetek announced today the immediate availability of its OEM-ready, LCLC liquid cooling solution for Intel Corporation's new Core i7 family of extreme processors and motherboards. Asetek's unique liquid cooling solution provides OEMs with an extremely high overclocking capability enabling them to deliver demanding gaming and entertainment applications with virtually no noise.

"The need for speed continues unabated," states Gary Baum, Asetek's Senior VP of Marketing & Sales. "By using our LCLC thermal solution, OEMs and system integrators are now able to take full advantage of Intel's powerful new processors and push the performance envelope to the extreme. Even more powerful workstations and PC gaming machines will be the result."

Asetek's highly integrated liquid cooling solution provides a new retention ring and back plate that makes the LCLC fully compatible with Intel's latest 1366-socketed motherboard architecture. Easy to install, the self-contained unit typically lowers the 130W Core i7 CPU temperature by often over 7 degrees Celsius , enabling it to run significantly cooler, providing the critical edge in advanced gaming or other graphics intensive applications. The Asetek solution is totally liquid cooled. OEMs can expect their units to run completely silent, except for the system heat exchanger fan that is 30 dB(A), as quiet as a whisper.

Asetek is the only liquid cooling company that provides rigorous OEM level reliability. Shock, vibration, and thermal stress testing assures a 50,000 hour operational lifetime with no end-user maintenance required. The units are factory sealed ensuring that end users will never have to perform maintenance such as adding fluids.

According to Baum, "Premier OEMs throughout the world continue to choose Asetek for their advanced computing applications since we clearly provide the best overall thermal management solution available on the market today. Our commitment to the OEM market is further demonstrated by our immediate support of Intel's highest performance processors and motherboards."
____________
Source: Email Press Release.

__________________