Fountain Valley, Calif. - (July 22, 2002) - Kingston® Technology Company, Inc. today announced the introduction of a proprietary, patent-pending, 3-dimensional memory module technology called Elevated Package Over CSP (EPOC™). This newly-developed technology, which raises the price-performance bar in high-capacity memory modules, will initially be available for high-capacity, 1.2-inch high, registered memory modules.
"Kingston's EPOC technology is a true win-win for Kingston and its customers," stated David Sun, co-founder and COO, Kingston. "The EPOC memory modules are an alternative to stacked-chip modules that will enable Kingston to stabilize the memory pricing volatility involved with third-party chip-stacking and reduce the production delays from weeks to days."
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PR <a target="_blank" href="http://www.kingston.com/press/2002/memory/prm0207a.asp"> HERE </a>
Kingston Announces (EPOC) Technology for Memory Modules
